Integration of Cu-CMP process with combination of abrasive-free copper polishing and low selective barrier polishing for 90nm Cu/low-k interconnect

Xianbin Wang*, Juan Boon Tan, Yong Kong Siew, Bei Chao Zhang, Wu Ping Liu, Fan Zhang, Lup San Leong, Raymond Joy, Liang Choo Hsia

*Corresponding author for this work

    Research output: Contribution to journalConference articlepeer-review

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