Investigation of on-chip integrated inductors fabricated in SOI-MUMPs for RF MEMS ICs

Fahimullah Khan; Mohammad I. Younis

doi:10.1007/s10470-020-01627-8

Investigation of on-chip integrated inductors fabricated in SOI-MUMPs for RF MEMS ICs

Fahimullah Khan, Mohammad I. Younis

Research output: Contribution to journal › Article › peer-review

1 Scopus citations

Abstract

This paper presents for the first time implementation of zig–zag and solenoidal on-chip inductors in standard and cost effective SOI-MUMPs fabrication process. The solenoidal inductor offers high Q-factor and inductance as compared to planar zig–zag inductor. Bonding wires are used to construct the top conductor loop of the solenoidal inductor. The inductors are also characterized at elevated temperature for performance investigation in harsh environment. The mechanical resonance frequency of the inductors are characterized using the Finite element software COMSOL. The inductors are characterized using a vector network analyzer from 60 MHz to 3 GHz, and the results of both inductors are compared. The total size of the device is 2 × 0.7 mm2.

Original language	English (US)
Journal	Analog Integrated Circuits and Signal Processing
DOIs	https://doi.org/10.1007/s10470-020-01627-8
State	Published - Mar 10 2020

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10.1007/s10470-020-01627-8

https://repository.kaust.edu.sa/bitstream/10754/662324/1/Manuscript2.pdf

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@article{78bb514a121c4af6ad2191c5cb15f7be,

title = "Investigation of on-chip integrated inductors fabricated in SOI-MUMPs for RF MEMS ICs",

abstract = "This paper presents for the first time implementation of zig–zag and solenoidal on-chip inductors in standard and cost effective SOI-MUMPs fabrication process. The solenoidal inductor offers high Q-factor and inductance as compared to planar zig–zag inductor. Bonding wires are used to construct the top conductor loop of the solenoidal inductor. The inductors are also characterized at elevated temperature for performance investigation in harsh environment. The mechanical resonance frequency of the inductors are characterized using the Finite element software COMSOL. The inductors are characterized using a vector network analyzer from 60 MHz to 3 GHz, and the results of both inductors are compared. The total size of the device is 2 × 0.7 mm2.",

author = "Fahimullah Khan and Younis, {Mohammad I.}",

note = "KAUST Repository Item: Exported on 2020-10-01 Acknowledgements: We acknowledge the financial support from King Abdullah University of Science and Technology (KAUST).",

year = "2020",

month = mar,

day = "10",

doi = "10.1007/s10470-020-01627-8",

language = "English (US)",

journal = "Analog Integrated Circuits and Signal Processing",

issn = "0925-1030",

publisher = "Springer Netherlands",

}

TY - JOUR

T1 - Investigation of on-chip integrated inductors fabricated in SOI-MUMPs for RF MEMS ICs

AU - Khan, Fahimullah

AU - Younis, Mohammad I.

N1 - KAUST Repository Item: Exported on 2020-10-01 Acknowledgements: We acknowledge the financial support from King Abdullah University of Science and Technology (KAUST).

PY - 2020/3/10

Y1 - 2020/3/10

N2 - This paper presents for the first time implementation of zig–zag and solenoidal on-chip inductors in standard and cost effective SOI-MUMPs fabrication process. The solenoidal inductor offers high Q-factor and inductance as compared to planar zig–zag inductor. Bonding wires are used to construct the top conductor loop of the solenoidal inductor. The inductors are also characterized at elevated temperature for performance investigation in harsh environment. The mechanical resonance frequency of the inductors are characterized using the Finite element software COMSOL. The inductors are characterized using a vector network analyzer from 60 MHz to 3 GHz, and the results of both inductors are compared. The total size of the device is 2 × 0.7 mm2.

AB - This paper presents for the first time implementation of zig–zag and solenoidal on-chip inductors in standard and cost effective SOI-MUMPs fabrication process. The solenoidal inductor offers high Q-factor and inductance as compared to planar zig–zag inductor. Bonding wires are used to construct the top conductor loop of the solenoidal inductor. The inductors are also characterized at elevated temperature for performance investigation in harsh environment. The mechanical resonance frequency of the inductors are characterized using the Finite element software COMSOL. The inductors are characterized using a vector network analyzer from 60 MHz to 3 GHz, and the results of both inductors are compared. The total size of the device is 2 × 0.7 mm2.

UR - http://hdl.handle.net/10754/662324

UR - http://link.springer.com/10.1007/s10470-020-01627-8

UR - http://www.scopus.com/inward/record.url?scp=85081896876&partnerID=8YFLogxK

U2 - 10.1007/s10470-020-01627-8

DO - 10.1007/s10470-020-01627-8

M3 - Article

SN - 0925-1030

JO - Analog Integrated Circuits and Signal Processing

JF - Analog Integrated Circuits and Signal Processing

ER -

Investigation of on-chip integrated inductors fabricated in SOI-MUMPs for RF MEMS ICs

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