Isothermal fatigue lifetime prediction of solder materials

Hareesh Mavoori*, Semyon Vaynman, Jason Chin, Brian Moran, Leon M. Keer, Morris E. Fine

*Corresponding author for this work

Research output: Contribution to journalConference articlepeer-review

1 Scopus citations

Abstract

Accurate prediction of fatigue lifetime is an essential ingredient in the assessment of structural reliability of existing solder materials and in the design of new ones. The isothermal fatigue properties of 97Sn/3Ag and 91Sn/9Zn solders were studied and compared to those of 63Sn/37Pb solders, with a view to determining whether the vast existing database for lead-based solders may be used as a guide for the newly emerging lead-free solders. The issue of definition of failure was considered in great detail and various failure criteria were compared for the 97Sn/3Ag case.

Original languageEnglish (US)
Pages (from-to)165-179
Number of pages15
JournalAmerican Society of Mechanical Engineers, Applied Mechanics Division, AMD
Volume195
StatePublished - 1994
Externally publishedYes
EventProceedings of the 1994 International Mechanical Engineering Congress and Exposition - Chicago, IL, USA
Duration: Nov 6 1994Nov 11 1994

ASJC Scopus subject areas

  • Mechanical Engineering

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