Lifetime prediction of solders in electronic packaging

Engineering

• Fatigue Damage 100%
• Assembly 66%
• State Temperature 33%
• Deformation 33%
• Internal Structure 33%
• Mechanical Loading 33%
• Fatigue Failure 33%
• Strain State 33%
• Continuum Mechanic Approach 33%
• Electronics Packaging 33%
• Prediction 33%
• Mechanisms 33%
• Defects 33%
• Energy Engineering 33%
• Environment 33%
• High Temperature 33%
• Yields 33%
• Mechanical Properties 33%
• Failure (Mechanical) 33%
• Crack 33%

Material Science

• Crack Propagation 100%
• Soldering Alloys 100%
• Material 66%
• Electronics 66%
• Ductile Material 33%
• Solder Joint 33%
• Thermal Cycling 33%
• Defect 33%
• Mechanical Property 33%
• Crack 33%
• Thermal Expansion 33%

Physics

• Solder 100%
• Strength of Materials 33%
• Deformation 33%
• Defects 33%
• Thermal Expansion 33%
• Frequencies 33%
• Environment 33%
• High Temperature 33%
• Cracks 33%
• Failure 33%