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Low temperature CVD route to binary and ternary diffusion barrier nitrides for Cu metallization
Alain E. Kaloyeros*, Jean Kelsey, Cindy Goldberg, Dalaver Anjum, Xiaomeng Chen, Jawid Mirza, Kaushik Kumar, Barry Arkles, Bin Han, John J. Sullivan
*Corresponding author for this work
Research output: Contribution to journal › Conference article › peer-review