Low temperature inorganic chemical vapor deposition of Ti-Si-N diffusion barrier liners for gigascale copper interconnect applications
Eric Eisenbraun*, Allan Upham, Raj Dash, Wanxue Zeng, Johann Hoefnagels, Sarah Lane, Dalaver Anjum, Katharine Dovidenko, Alain Kaloyeros, Barry Arkles, John J. Sullivan
*Corresponding author for this work
Research output: Contribution to journal › Article › peer-review
Dive into the research topics of 'Low temperature inorganic chemical vapor deposition of Ti-Si-N diffusion barrier liners for gigascale copper interconnect applications'. Together they form a unique fingerprint.