Abstract
Eutectic Sn-Ag and Sn-Zn solders are currently being investigated as the basis for replacement of Sn-Pb solders. Some mechanical properties of these solder systems - fatigue, tensile, stress relaxation and creep are presented here along with some damage feature observations for eutectic Sn-Ag solder. Semi-empirical modeling, constitutive modeling and numerical simulation based on damage models have been carried out for lifetime prediction. Preliminary agreement of this numerical simulation with experimental results appears encouraging, but the models need further refinement.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 161-175 |
| Number of pages | 15 |
| Journal | Materials Research Society Symposium - Proceedings |
| Volume | 390 |
| State | Published - 1995 |
| Externally published | Yes |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials