Metallization schemes for dielectric thin film capacitors

H. N. Al-Shareef; D. Dimos; B. A. Tuttle; M. V. Raymond

doi:10.1557/JMR.1997.0050

Metallization schemes for dielectric thin film capacitors

H. N. Al-Shareef^*, D. Dimos, B. A. Tuttle, M. V. Raymond

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

31 Scopus citations

Abstract

A detailed analysis of Pt/Ti, Pt/TiO₂, and Pt/ZrO₂ electrodes was carried out to develop a bottom electrode stack for sol-gel derived thin film capacitors. For the Pt/Ti stack, the choice of layer thickness and deposition temperature is found to affect adhesion to the SiO₂/Si substrate as well as the extent of hillock formation and Pt-Ti interaction. By using elevated temperature deposition, Pt films close to 1 μm in thickness can be produced with relatively good adhesion and morphological stability using Ti adhesion layers. In addition, Pt films grown on ZrO₂ and TiO₂ adhesion layers exhibit little morphological change and no degradation in sheet resistance after annealing at 650 °C, However, neither ZrO₂ nor TiO₂ are as effective as Ti metal in promoting Pt adhesion. Experiments aimed at establishing a correlation between hillock formation and capacitor yield revealed two important results. First, the behavior of Pt/Ti stacks during annealing in air is markedly different from their behavior during PZT film crystallization. Second, preannealing of the Pt/Ti in air prior to PZT film growth actually improves capacitor yield, even though hillock formation occurs during the preannealing treatment. Implications of these results regarding the role of hillocks in controlling capacitor yield are discussed.

Original language	English (US)
Pages (from-to)	347-354
Number of pages	8
Journal	Journal of Materials Research
Volume	12
Issue number	2
DOIs	https://doi.org/10.1557/JMR.1997.0050
State	Published - Feb 1997
Externally published	Yes

ASJC Scopus subject areas

General Materials Science
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering

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title = "Metallization schemes for dielectric thin film capacitors",

abstract = "A detailed analysis of Pt/Ti, Pt/TiO2, and Pt/ZrO2 electrodes was carried out to develop a bottom electrode stack for sol-gel derived thin film capacitors. For the Pt/Ti stack, the choice of layer thickness and deposition temperature is found to affect adhesion to the SiO2/Si substrate as well as the extent of hillock formation and Pt-Ti interaction. By using elevated temperature deposition, Pt films close to 1 μm in thickness can be produced with relatively good adhesion and morphological stability using Ti adhesion layers. In addition, Pt films grown on ZrO2 and TiO2 adhesion layers exhibit little morphological change and no degradation in sheet resistance after annealing at 650 °C, However, neither ZrO2 nor TiO2 are as effective as Ti metal in promoting Pt adhesion. Experiments aimed at establishing a correlation between hillock formation and capacitor yield revealed two important results. First, the behavior of Pt/Ti stacks during annealing in air is markedly different from their behavior during PZT film crystallization. Second, preannealing of the Pt/Ti in air prior to PZT film growth actually improves capacitor yield, even though hillock formation occurs during the preannealing treatment. Implications of these results regarding the role of hillocks in controlling capacitor yield are discussed.",

author = "Al-Shareef, {H. N.} and D. Dimos and Tuttle, {B. A.} and Raymond, {M. V.}",

year = "1997",

month = feb,

doi = "10.1557/JMR.1997.0050",

language = "English (US)",

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pages = "347--354",

journal = "Journal of Materials Research",

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T1 - Metallization schemes for dielectric thin film capacitors

AU - Al-Shareef, H. N.

AU - Dimos, D.

AU - Tuttle, B. A.

AU - Raymond, M. V.

PY - 1997/2

Y1 - 1997/2

N2 - A detailed analysis of Pt/Ti, Pt/TiO2, and Pt/ZrO2 electrodes was carried out to develop a bottom electrode stack for sol-gel derived thin film capacitors. For the Pt/Ti stack, the choice of layer thickness and deposition temperature is found to affect adhesion to the SiO2/Si substrate as well as the extent of hillock formation and Pt-Ti interaction. By using elevated temperature deposition, Pt films close to 1 μm in thickness can be produced with relatively good adhesion and morphological stability using Ti adhesion layers. In addition, Pt films grown on ZrO2 and TiO2 adhesion layers exhibit little morphological change and no degradation in sheet resistance after annealing at 650 °C, However, neither ZrO2 nor TiO2 are as effective as Ti metal in promoting Pt adhesion. Experiments aimed at establishing a correlation between hillock formation and capacitor yield revealed two important results. First, the behavior of Pt/Ti stacks during annealing in air is markedly different from their behavior during PZT film crystallization. Second, preannealing of the Pt/Ti in air prior to PZT film growth actually improves capacitor yield, even though hillock formation occurs during the preannealing treatment. Implications of these results regarding the role of hillocks in controlling capacitor yield are discussed.

AB - A detailed analysis of Pt/Ti, Pt/TiO2, and Pt/ZrO2 electrodes was carried out to develop a bottom electrode stack for sol-gel derived thin film capacitors. For the Pt/Ti stack, the choice of layer thickness and deposition temperature is found to affect adhesion to the SiO2/Si substrate as well as the extent of hillock formation and Pt-Ti interaction. By using elevated temperature deposition, Pt films close to 1 μm in thickness can be produced with relatively good adhesion and morphological stability using Ti adhesion layers. In addition, Pt films grown on ZrO2 and TiO2 adhesion layers exhibit little morphological change and no degradation in sheet resistance after annealing at 650 °C, However, neither ZrO2 nor TiO2 are as effective as Ti metal in promoting Pt adhesion. Experiments aimed at establishing a correlation between hillock formation and capacitor yield revealed two important results. First, the behavior of Pt/Ti stacks during annealing in air is markedly different from their behavior during PZT film crystallization. Second, preannealing of the Pt/Ti in air prior to PZT film growth actually improves capacitor yield, even though hillock formation occurs during the preannealing treatment. Implications of these results regarding the role of hillocks in controlling capacitor yield are discussed.

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Metallization schemes for dielectric thin film capacitors

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