Modeling and evaluating carbon nanotube bundles for future VLSI interconnect applications

Yehia Massoud, Arthur Nieuwoudt

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Scopus citations

Fingerprint

Dive into the research topics of 'Modeling and evaluating carbon nanotube bundles for future VLSI interconnect applications'. Together they form a unique fingerprint.

Engineering

Computer Science

Mathematics

Keyphrases