TY - GEN
T1 - Modeling and Simulation of A MEMS Resonator Based Reprogrammable Logic Gate Using Partial Electrodes
AU - Ahmed, Sally
AU - Li, Ren
AU - Zou, Xuecui
AU - Al Hafiz, Md Abdullah
AU - Fariborzi, Hossein
N1 - KAUST Repository Item: Exported on 2020-10-01
Acknowledged KAUST grant number(s): OSR-2016-CRG5-3001
Acknowledgements: This work is supported by King Abdullah University of Science and Technology (KAUST) office of sponsored research (OSR) under Award No. OSR-2016-CRG5-3001.
PY - 2019/7/4
Y1 - 2019/7/4
N2 - In this work, we present a reprogrammable micro-resonator logic gate designed with an industrial standard process. The device operation is based on altering the resonance frequency of the beam using DC digital inputs. The proposed design methodology reduces design complexity by 4 to 10 times compared to traditional CMOS design techniques and has great potential for improving energy efficiency. The proposed device has been simulated by MEMS+ software provided by Coventor using XMB10_M30 process design kit (PDK) and then exported into Cadence for further simulations and layout creation following XMB10 process provided by X-FAB.
AB - In this work, we present a reprogrammable micro-resonator logic gate designed with an industrial standard process. The device operation is based on altering the resonance frequency of the beam using DC digital inputs. The proposed design methodology reduces design complexity by 4 to 10 times compared to traditional CMOS design techniques and has great potential for improving energy efficiency. The proposed device has been simulated by MEMS+ software provided by Coventor using XMB10_M30 process design kit (PDK) and then exported into Cadence for further simulations and layout creation following XMB10 process provided by X-FAB.
UR - http://hdl.handle.net/10754/632553
UR - https://ieeexplore.ieee.org/document/8752880/
UR - http://www.scopus.com/inward/record.url?scp=85069505842&partnerID=8YFLogxK
U2 - 10.1109/DTIP.2019.8752880
DO - 10.1109/DTIP.2019.8752880
M3 - Conference contribution
SN - 9781728132884
BT - 2019 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP)
PB - Institute of Electrical and Electronics Engineers (IEEE)
ER -