Multiple layers of copper thin films of alternating textures

In this paper, we present a preliminary study of texture development during copper thin film deposition. Using direct current (DC) magnetron sputtering technique, we deposit copper films on a SiO₂/Si(111) substrate. A thin layer of copper of 〈111〉 texture first develops, and another thin layer of 〈110〉 ensues. As deposition continues, a third layer of copper of 〈111〉 texture forms on the top, leading to a copper thin film of alternating 〈111〉 and 〈110〉 textures. The multiple layers of copper thin films of alternating textures form during continuous deposition without changing deposition conditions. The film morphology is characterized with scanning electron microscopy (SEM) and atomic force microscopy (AFM), and the texture with X-ray diffraction (XRD). Based on anisotropic elastic analyses and molecular dynamics simulations, we propose a model of texture evolution during the formation of multilayers, attributing the texture evolution to the competition of surface and strain energies.