On the impact of process variations for carbon nanotube bundles for VLSI interconnect

Keyphrases

• Process Variation 100%
• Carbon Nanotube Bundle 100%
• Single-walled Carbon Nanotubes Bundles 100%
• VLSI Interconnects 100%
• Copper Interconnect 60%
• Nanotubes 40%
• Relative Impact 40%
• Process Technology 40%
• On chip 20%
• Multi-walled Carbon Nanotubes (MWCNTs) 20%
• Current Carrying Capacity 20%
• Inductance 20%
• Capacitance Model 20%
• Copper Wire 20%
• Sources of Variation 20%
• Manufacturing Challenges 20%
• 3-sigma 20%
• Equivalent RLC Model 20%

Engineering

• Process Variation 100%
• Interconnects 100%
• Carbon Nanotubes 100%
• Single-Walled Carbon Nanotube 60%
• Nanotubes 20%
• Potential Source 10%
• Copper Wire 10%

Computer Science

• Process Variation 100%
• Relative Impact 66%