In this paper, we present a comprehensive model for the resistance in graphene nanoribbon (GNR) interconnects. We use the recent experimental and theoretical results to model the impact of stacking of graphene layers in multi-layer GNR interconnects. We compare the resistance of GNR interconnects with both single-walled carbon nanotube (SWCNT) bundle interconnects and conventional copper Interconnects. Our simulation results demonstrate the performance superiority of multi-layer GNR interconnects over conventional copper interconnects at small widths (< 15 nm). Consequently, multi-layer GNR interconnects demonstrate a great potential to replace conventioanl copper interconnects in future technologies.
|Title of host publication
|IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD
|Number of pages
|Published - Dec 26 2008