Out-of-plane deformable semiconductor substrate, method of making an out-of-plane deformable semiconductor substrate, and an in-plane and out-of-plane deformable semiconductor substrate

SEPULVEDA Adrián César CAVAZOS; Muhammad Mustafa Hussain

Out-of-plane deformable semiconductor substrate, method of making an out-of-plane deformable semiconductor substrate, and an in-plane and out-of-plane deformable semiconductor substrate

SEPULVEDA Adrián César CAVAZOS (Inventor), Muhammad Mustafa Hussain (Inventor)

Research output: Patent

Abstract

An out-of-plane deformable semiconductor substrate includes a plurality of rigid portions having a first thickness and an out-of-plane deformable portion having a second thickness and connecting the plurality of rigid portions to each other. The second thickness is smaller than the first thickness. The out-of-plane deformable semiconductor substrate is monolithic.

Original language	English (US)
Patent number	WO2018096454A1
State	Published - May 31 2018

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https://repository.kaust.edu.sa/bitstream/10754/629710/1/WO2018096454A1.pdf

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@misc{e89ae72fee4548c39e83ef398b3265ef,

title = "Out-of-plane deformable semiconductor substrate, method of making an out-of-plane deformable semiconductor substrate, and an in-plane and out-of-plane deformable semiconductor substrate",

abstract = "An out-of-plane deformable semiconductor substrate includes a plurality of rigid portions having a first thickness and an out-of-plane deformable portion having a second thickness and connecting the plurality of rigid portions to each other. The second thickness is smaller than the first thickness. The out-of-plane deformable semiconductor substrate is monolithic.",

author = "CAVAZOS, {SEPULVEDA Adri{\'a}n C{\'e}sar} and Hussain, {Muhammad Mustafa}",

note = "KAUST Repository Item: Exported on 2019-02-13; WO2018096454A1",

year = "2018",

month = may,

day = "31",

language = "English (US)",

type = "Patent",

}

TY - PAT

T1 - Out-of-plane deformable semiconductor substrate, method of making an out-of-plane deformable semiconductor substrate, and an in-plane and out-of-plane deformable semiconductor substrate

AU - CAVAZOS, SEPULVEDA Adrián César

AU - Hussain, Muhammad Mustafa

N1 - KAUST Repository Item: Exported on 2019-02-13

PY - 2018/5/31

Y1 - 2018/5/31

N2 - An out-of-plane deformable semiconductor substrate includes a plurality of rigid portions having a first thickness and an out-of-plane deformable portion having a second thickness and connecting the plurality of rigid portions to each other. The second thickness is smaller than the first thickness. The out-of-plane deformable semiconductor substrate is monolithic.

AB - An out-of-plane deformable semiconductor substrate includes a plurality of rigid portions having a first thickness and an out-of-plane deformable portion having a second thickness and connecting the plurality of rigid portions to each other. The second thickness is smaller than the first thickness. The out-of-plane deformable semiconductor substrate is monolithic.

UR - http://hdl.handle.net/10754/629710

UR - https://patents.google.com/patent/WO2018096454A1/en

M3 - Patent

M1 - WO2018096454A1

ER -

Out-of-plane deformable semiconductor substrate, method of making an out-of-plane deformable semiconductor substrate, and an in-plane and out-of-plane deformable semiconductor substrate

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