Platform Isolation Using Out-of-Plane Complaint Mechanisms

A. Arevalo; E. Rawashdeh; I. G. Foulds

Platform Isolation Using Out-of-Plane Complaint Mechanisms

A. Arevalo, E. Rawashdeh, I. G. Foulds

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

This paper reports the structural solid mechanic simulation of a MEMS out-of-plane platform that provides thermal and electrical isolation for a device built on it. When assemble, the platform lifted for approximately 400 μm above the substrate level. A mechanical stress analysis is then presented in order to evaluate the feasibility of building it using commonly used materials in MEMS. Our analysis showed that polymeric materials such as polyimide and SU8 may undergo a localized plastic deformation but are not likely to fail upon assembly. Polysilicon on the contrary, showed high failure probability.

Original language	English (US)
Title of host publication	Proceedings of the 2014 COMSOL Conference in Boston
State	Published - Oct 8 2014
Externally published	Yes

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Cite this

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title = "Platform Isolation Using Out-of-Plane Complaint Mechanisms",

abstract = "This paper reports the structural solid mechanic simulation of a MEMS out-of-plane platform that provides thermal and electrical isolation for a device built on it. When assemble, the platform lifted for approximately 400 μm above the substrate level. A mechanical stress analysis is then presented in order to evaluate the feasibility of building it using commonly used materials in MEMS. Our analysis showed that polymeric materials such as polyimide and SU8 may undergo a localized plastic deformation but are not likely to fail upon assembly. Polysilicon on the contrary, showed high failure probability.",

author = "A. Arevalo and E. Rawashdeh and Foulds, {I. G.}",

note = "KAUST Repository Item: Exported on 2020-10-01",

year = "2014",

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day = "8",

language = "English (US)",

booktitle = "Proceedings of the 2014 COMSOL Conference in Boston",

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T1 - Platform Isolation Using Out-of-Plane Complaint Mechanisms

AU - Arevalo, A.

AU - Rawashdeh, E.

AU - Foulds, I. G.

N1 - KAUST Repository Item: Exported on 2020-10-01

PY - 2014/10/8

Y1 - 2014/10/8

N2 - This paper reports the structural solid mechanic simulation of a MEMS out-of-plane platform that provides thermal and electrical isolation for a device built on it. When assemble, the platform lifted for approximately 400 μm above the substrate level. A mechanical stress analysis is then presented in order to evaluate the feasibility of building it using commonly used materials in MEMS. Our analysis showed that polymeric materials such as polyimide and SU8 may undergo a localized plastic deformation but are not likely to fail upon assembly. Polysilicon on the contrary, showed high failure probability.

AB - This paper reports the structural solid mechanic simulation of a MEMS out-of-plane platform that provides thermal and electrical isolation for a device built on it. When assemble, the platform lifted for approximately 400 μm above the substrate level. A mechanical stress analysis is then presented in order to evaluate the feasibility of building it using commonly used materials in MEMS. Our analysis showed that polymeric materials such as polyimide and SU8 may undergo a localized plastic deformation but are not likely to fail upon assembly. Polysilicon on the contrary, showed high failure probability.

UR - http://hdl.handle.net/10754/581359

UR - https://www.comsol.com/paper/platform-isolation-using-out-of-plane-complaint-mechanisms-19569

M3 - Conference contribution

BT - Proceedings of the 2014 COMSOL Conference in Boston

ER -

Platform Isolation Using Out-of-Plane Complaint Mechanisms

Abstract

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