Keyphrases
Active Devices
50%
Active Structure
50%
Actuator
50%
Bending Beam
50%
Bilayer Lift-off
50%
Coefficient of Thermal Expansion
100%
Commercially Available
100%
Deep UV
50%
Metal Layer
50%
Microfabrication
50%
Micromachining
50%
Structural Materials
100%
Surface Micromachining
100%
Thermomechanical Properties
50%
Young's Modulus
100%
Engineering
Active Device
50%
Coefficient of Thermal Expansion
100%
Metal Layer
50%
Micro Machining
50%
Microfabrication
50%
Structural Materials
100%
Surface Micro-Machining
100%
Young's Modulus
100%
Material Science
Actuator
33%
Building Material
100%
Microfabrication
33%
Micromachining
100%
Thermal Expansion
66%
Thermomechanical Property
33%
Young's Modulus
66%