TY - JOUR
T1 - Probing Ultrafast Interfacial Carrier Dynamics in Metal Halide Perovskite Films and Devices by Transient Reflection Spectroscopy
AU - Gao, Yajun
AU - Liu, Jiang
AU - Isikgor, Furkan Halis
AU - Wang, Mingcong
AU - Khan, Jafar Iqbal
AU - De Wolf, Stefaan
AU - Laquai, Frédéric
N1 - KAUST Repository Item: Exported on 2022-05-16
Acknowledged KAUST grant number(s): OSR-CARF/CCF-3079, OSR-CRG2018-3737, OSR-CRG2019-4093, ORA-CRG2021-4681
Acknowledgements: Supported by the King Abdullah University of Science and Technology (KAUST) Office of Sponsored Research (OSR) under Awards OSR-CARF/CCF-3079, OSR-CRG2018-3737, OSR-CRG2019-4093, and ORA-CRG2021-4681.
PY - 2022/5/13
Y1 - 2022/5/13
N2 - Interfaces in metal halide perovskite (MHP) solar cells cause carrier recombination and thereby reduce their power conversion efficiency. Here, ultrafast (picosecond to nanosecond) transient reflection (TR) spectroscopy has been used to probe interfacial carrier dynamics in thin films of the reference MHP MAPbI3 and state-of-the-art (Cs0.15MA0.15FA0.70)Pb(Br0.20I0.80)3 (CsFAMA). First, MAPbI3 films in contact with fullerene-based charge extraction layers (CTLs) in the presence and absence of LiF used as an interlayer (ITL) were studied. To quantify and discriminate between interface-induced and bulk carrier recombination, we employed a one-dimensional diffusion and recombination model. The interface-induced carrier recombination velocity was found to be 1229 ± 78 cm s–1 in nonpassivated MAPbI3 films, which was increased to 2248 ± 75 cm s–1 when MAPbI3 interfaced directly with C60, whereas it was reduced to 145 ± 63 cm s–1 when inserting a 1 nm thin LiF interlayer between MAPbI3 and C60, in turn improving the open-circuit voltage of devices by 33 mV. Second, the effect of surface and grain boundary passivation by PhenHCl in CsFAMA was revealed. Here, the recombination velocity decreased from 605 ± 52 to 0.16 ± 5.28 and 7.294 ± 34.5 cm s–1, respectively. The approach and data analysis presented here are immediately applicable to other perovskite/interlayer/CTL interfaces and passivation protocols, and they add to our understanding of the impact of surfaces and interfaces in MHP-based thin films on carrier recombination and device efficiency.
AB - Interfaces in metal halide perovskite (MHP) solar cells cause carrier recombination and thereby reduce their power conversion efficiency. Here, ultrafast (picosecond to nanosecond) transient reflection (TR) spectroscopy has been used to probe interfacial carrier dynamics in thin films of the reference MHP MAPbI3 and state-of-the-art (Cs0.15MA0.15FA0.70)Pb(Br0.20I0.80)3 (CsFAMA). First, MAPbI3 films in contact with fullerene-based charge extraction layers (CTLs) in the presence and absence of LiF used as an interlayer (ITL) were studied. To quantify and discriminate between interface-induced and bulk carrier recombination, we employed a one-dimensional diffusion and recombination model. The interface-induced carrier recombination velocity was found to be 1229 ± 78 cm s–1 in nonpassivated MAPbI3 films, which was increased to 2248 ± 75 cm s–1 when MAPbI3 interfaced directly with C60, whereas it was reduced to 145 ± 63 cm s–1 when inserting a 1 nm thin LiF interlayer between MAPbI3 and C60, in turn improving the open-circuit voltage of devices by 33 mV. Second, the effect of surface and grain boundary passivation by PhenHCl in CsFAMA was revealed. Here, the recombination velocity decreased from 605 ± 52 to 0.16 ± 5.28 and 7.294 ± 34.5 cm s–1, respectively. The approach and data analysis presented here are immediately applicable to other perovskite/interlayer/CTL interfaces and passivation protocols, and they add to our understanding of the impact of surfaces and interfaces in MHP-based thin films on carrier recombination and device efficiency.
UR - http://hdl.handle.net/10754/677913
UR - https://pubs.acs.org/doi/10.1021/acsami.2c03016
U2 - 10.1021/acsami.2c03016
DO - 10.1021/acsami.2c03016
M3 - Article
C2 - 35559656
SN - 1944-8244
JO - ACS Applied Materials & Interfaces
JF - ACS Applied Materials & Interfaces
ER -