Quantitative comparison of adhesive toughness for various diamond films on co-cemented tungsten carbide

Shoji Kamiya; Hironori Takahashi; Pierangelo D'Antonio; Riccardo Polini; Enrico Traversa

doi:10.1016/S0925-9635(01)00709-9

Quantitative comparison of adhesive toughness for various diamond films on co-cemented tungsten carbide

Shoji Kamiya, Hironori Takahashi, Pierangelo D'Antonio, Riccardo Polini^*, Enrico Traversa

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

6 Scopus citations

Abstract

A new method of quantitative evaluation for the toughness of interface between thick diamond films and Co-cemented tungsten carbide (WC-Co) substrates is reported. This new method derives from the previously developed technique, which was applied for the quantitative evaluation of the adhesive toughness of discrete diamond crystallites on Co-cemented tungsten carbide (WC-Co) substrates [S. Kamiya et al., Diamond Relat. Mater. 9 (2000) 191-194] and has been applied here to evaluate the adhesive toughness of various diamond films on WC-Co cutting inserts. The adhesive toughness was successfully obtained to be in the 15-23 J/m² range and was depending on the morphology of the interface.

Original language	English (US)
Pages (from-to)	716-720
Number of pages	5
Journal	Diamond and Related Materials
Volume	11
Issue number	3-6
DOIs	https://doi.org/10.1016/S0925-9635(01)00709-9
State	Published - Mar 2002
Externally published	Yes

Keywords

Adhesion strength
Chemical vapor deposition
Diamond coated tools
Tungsten carbide

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
General Chemistry
Mechanical Engineering
Materials Chemistry
Electrical and Electronic Engineering

Access to Document

10.1016/S0925-9635(01)00709-9

Cite this

@article{5ce8839fd38e488ab835eb6f18abbd14,

title = "Quantitative comparison of adhesive toughness for various diamond films on co-cemented tungsten carbide",

abstract = "A new method of quantitative evaluation for the toughness of interface between thick diamond films and Co-cemented tungsten carbide (WC-Co) substrates is reported. This new method derives from the previously developed technique, which was applied for the quantitative evaluation of the adhesive toughness of discrete diamond crystallites on Co-cemented tungsten carbide (WC-Co) substrates [S. Kamiya et al., Diamond Relat. Mater. 9 (2000) 191-194] and has been applied here to evaluate the adhesive toughness of various diamond films on WC-Co cutting inserts. The adhesive toughness was successfully obtained to be in the 15-23 J/m2 range and was depending on the morphology of the interface.",

keywords = "Adhesion strength, Chemical vapor deposition, Diamond coated tools, Tungsten carbide",

author = "Shoji Kamiya and Hironori Takahashi and Pierangelo D'Antonio and Riccardo Polini and Enrico Traversa",

year = "2002",

month = mar,

doi = "10.1016/S0925-9635(01)00709-9",

language = "English (US)",

volume = "11",

pages = "716--720",

journal = "Diamond and Related Materials",

issn = "0925-9635",

publisher = "Elsevier B.V.",

number = "3-6",

}

TY - JOUR

T1 - Quantitative comparison of adhesive toughness for various diamond films on co-cemented tungsten carbide

AU - Kamiya, Shoji

AU - Takahashi, Hironori

AU - D'Antonio, Pierangelo

AU - Polini, Riccardo

AU - Traversa, Enrico

PY - 2002/3

Y1 - 2002/3

N2 - A new method of quantitative evaluation for the toughness of interface between thick diamond films and Co-cemented tungsten carbide (WC-Co) substrates is reported. This new method derives from the previously developed technique, which was applied for the quantitative evaluation of the adhesive toughness of discrete diamond crystallites on Co-cemented tungsten carbide (WC-Co) substrates [S. Kamiya et al., Diamond Relat. Mater. 9 (2000) 191-194] and has been applied here to evaluate the adhesive toughness of various diamond films on WC-Co cutting inserts. The adhesive toughness was successfully obtained to be in the 15-23 J/m2 range and was depending on the morphology of the interface.

AB - A new method of quantitative evaluation for the toughness of interface between thick diamond films and Co-cemented tungsten carbide (WC-Co) substrates is reported. This new method derives from the previously developed technique, which was applied for the quantitative evaluation of the adhesive toughness of discrete diamond crystallites on Co-cemented tungsten carbide (WC-Co) substrates [S. Kamiya et al., Diamond Relat. Mater. 9 (2000) 191-194] and has been applied here to evaluate the adhesive toughness of various diamond films on WC-Co cutting inserts. The adhesive toughness was successfully obtained to be in the 15-23 J/m2 range and was depending on the morphology of the interface.

KW - Adhesion strength

KW - Chemical vapor deposition

KW - Diamond coated tools

KW - Tungsten carbide

UR - http://www.scopus.com/inward/record.url?scp=0036508231&partnerID=8YFLogxK

U2 - 10.1016/S0925-9635(01)00709-9

DO - 10.1016/S0925-9635(01)00709-9

M3 - Article

AN - SCOPUS:0036508231

SN - 0925-9635

VL - 11

SP - 716

EP - 720

JO - Diamond and Related Materials

JF - Diamond and Related Materials

IS - 3-6

ER -

Quantitative comparison of adhesive toughness for various diamond films on co-cemented tungsten carbide

Abstract

Keywords

ASJC Scopus subject areas

Access to Document

Other files and links

Fingerprint

Cite this