Quantitative determination of the adhesive fracture toughness of CVD diamond to WC-Co cemented carbide

S. Kamiya; H. Takahashi; R. Polini; E. Traversa

doi:10.1016/S0925-9635(00)00229-6

Quantitative determination of the adhesive fracture toughness of CVD diamond to WC-Co cemented carbide

S. Kamiya^*, H. Takahashi, R. Polini, E. Traversa

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

46 Scopus citations

Abstract

Well-separated diamond particles were nucleated and grown by hot filament chemical vapor deposition (HFCVD) onto WC-Co cemented carbide pretreated by Murakami's reagent and H₂O₂ + H₂SO₄ solution. The adhesive strength of diamond particles to WC-Co cemented carbide was quantitatively determined in terms of interface toughness by directly applying an external load to the CVD diamond particles. From the measurement of the maximum load required to scratch off the particles, we determined that the adhesive toughness was 14 J/m². This value is more than twice as high as that of CVD diamond on smooth silicon substrate and comparable to the cleavage fracture energy of diamond. The newly developed procedure will allow to check the effectiveness of substrate surface pretreatments for further improving the adhesion level of diamond films on WC-Co. (C) 2000 Elsevier Science S.A. All rights reserved.

Original language	English (US)
Pages (from-to)	191-194
Number of pages	4
Journal	Diamond and Related Materials
Volume	9
Issue number	2
DOIs	https://doi.org/10.1016/S0925-9635(00)00229-6
State	Published - Mar 1 2000
Externally published	Yes

Keywords

Chemical vapor deposition
Interface/interfacial
Mechanical properties
Pretreated substrate

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
General Chemistry
Mechanical Engineering
Materials Chemistry
Electrical and Electronic Engineering

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10.1016/S0925-9635(00)00229-6

Cite this

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title = "Quantitative determination of the adhesive fracture toughness of CVD diamond to WC-Co cemented carbide",

abstract = "Well-separated diamond particles were nucleated and grown by hot filament chemical vapor deposition (HFCVD) onto WC-Co cemented carbide pretreated by Murakami's reagent and H2O2 + H2SO4 solution. The adhesive strength of diamond particles to WC-Co cemented carbide was quantitatively determined in terms of interface toughness by directly applying an external load to the CVD diamond particles. From the measurement of the maximum load required to scratch off the particles, we determined that the adhesive toughness was 14 J/m2. This value is more than twice as high as that of CVD diamond on smooth silicon substrate and comparable to the cleavage fracture energy of diamond. The newly developed procedure will allow to check the effectiveness of substrate surface pretreatments for further improving the adhesion level of diamond films on WC-Co. (C) 2000 Elsevier Science S.A. All rights reserved.",

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author = "S. Kamiya and H. Takahashi and R. Polini and E. Traversa",

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T1 - Quantitative determination of the adhesive fracture toughness of CVD diamond to WC-Co cemented carbide

AU - Kamiya, S.

AU - Takahashi, H.

AU - Polini, R.

AU - Traversa, E.

PY - 2000/3/1

Y1 - 2000/3/1

N2 - Well-separated diamond particles were nucleated and grown by hot filament chemical vapor deposition (HFCVD) onto WC-Co cemented carbide pretreated by Murakami's reagent and H2O2 + H2SO4 solution. The adhesive strength of diamond particles to WC-Co cemented carbide was quantitatively determined in terms of interface toughness by directly applying an external load to the CVD diamond particles. From the measurement of the maximum load required to scratch off the particles, we determined that the adhesive toughness was 14 J/m2. This value is more than twice as high as that of CVD diamond on smooth silicon substrate and comparable to the cleavage fracture energy of diamond. The newly developed procedure will allow to check the effectiveness of substrate surface pretreatments for further improving the adhesion level of diamond films on WC-Co. (C) 2000 Elsevier Science S.A. All rights reserved.

AB - Well-separated diamond particles were nucleated and grown by hot filament chemical vapor deposition (HFCVD) onto WC-Co cemented carbide pretreated by Murakami's reagent and H2O2 + H2SO4 solution. The adhesive strength of diamond particles to WC-Co cemented carbide was quantitatively determined in terms of interface toughness by directly applying an external load to the CVD diamond particles. From the measurement of the maximum load required to scratch off the particles, we determined that the adhesive toughness was 14 J/m2. This value is more than twice as high as that of CVD diamond on smooth silicon substrate and comparable to the cleavage fracture energy of diamond. The newly developed procedure will allow to check the effectiveness of substrate surface pretreatments for further improving the adhesion level of diamond films on WC-Co. (C) 2000 Elsevier Science S.A. All rights reserved.

KW - Chemical vapor deposition

KW - Interface/interfacial

KW - Mechanical properties

KW - Pretreated substrate

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JO - Diamond and Related Materials

JF - Diamond and Related Materials

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Quantitative determination of the adhesive fracture toughness of CVD diamond to WC-Co cemented carbide

Abstract

Keywords

ASJC Scopus subject areas

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