Realities and Challenges of III-V/Si Integration Technologies

John E. Bowers; Duanni Huang; Daehwan Jung; Justin Norman; Minh A. Tran; Yating Wan; Weiqiang Xie; Zeyu Zhang

doi:10.1364/ofc.2019.tu3e.1

Realities and Challenges of III-V/Si Integration Technologies

John E. Bowers, Duanni Huang, Daehwan Jung, Justin Norman, Minh A. Tran, Yating Wan, Weiqiang Xie, Zeyu Zhang

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

6 Scopus citations

Abstract

The complexity of photonic integrated circuits has progressed rapidly, but serious problems remain to be solved to enable widespread application in Tbps transceivers and optical scanners. A summary of progress, problems and potential solutions is provided.

Original language	English (US)
Title of host publication	2019 Optical Fiber Communications Conference and Exhibition, OFC 2019 - Proceedings
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Print)	9781943580538
DOIs	https://doi.org/10.1364/ofc.2019.tu3e.1
State	Published - Apr 22 2019
Externally published	Yes

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10.1364/ofc.2019.tu3e.1

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title = "Realities and Challenges of III-V/Si Integration Technologies",

abstract = "The complexity of photonic integrated circuits has progressed rapidly, but serious problems remain to be solved to enable widespread application in Tbps transceivers and optical scanners. A summary of progress, problems and potential solutions is provided.",

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AU - Bowers, John E.

AU - Huang, Duanni

AU - Jung, Daehwan

AU - Norman, Justin

AU - Tran, Minh A.

AU - Wan, Yating

AU - Xie, Weiqiang

AU - Zhang, Zeyu

N1 - Generated from Scopus record by KAUST IRTS on 2023-09-18

PY - 2019/4/22

Y1 - 2019/4/22

N2 - The complexity of photonic integrated circuits has progressed rapidly, but serious problems remain to be solved to enable widespread application in Tbps transceivers and optical scanners. A summary of progress, problems and potential solutions is provided.

AB - The complexity of photonic integrated circuits has progressed rapidly, but serious problems remain to be solved to enable widespread application in Tbps transceivers and optical scanners. A summary of progress, problems and potential solutions is provided.

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U2 - 10.1364/ofc.2019.tu3e.1

DO - 10.1364/ofc.2019.tu3e.1

M3 - Conference contribution

SN - 9781943580538

BT - 2019 Optical Fiber Communications Conference and Exhibition, OFC 2019 - Proceedings

PB - Institute of Electrical and Electronics Engineers Inc.

ER -

Realities and Challenges of III-V/Si Integration Technologies

Abstract

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