Room temperature hermetic sealing of microelectronic packages with nanoscale multilayer reactive foils

M. Powers*, J. Subramanian, J. Levin, T. Rude, D. Van Heerden, O. Knio

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

2 Scopus citations

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Engineering

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Material Science