TY - JOUR
T1 - Room to high temperature measurements of flexible SOI FinFETs with sub-20-nm fins
AU - Diab, Amer El Hajj
AU - Sevilla, Galo T.
AU - Cristoloveanu, Sorin
AU - Hussain, Muhammad Mustafa
N1 - KAUST Repository Item: Exported on 2020-10-01
Acknowledgements: This work was supported by the King Abdullah University of Science and Technology, Jeddah, Saudi Arabia, through the Office of Competitive Research Funds under Grant CRG-1-2012-HUS-008. The review of this paper was arranged by Editor N. Bhat.
PY - 2014/12
Y1 - 2014/12
N2 - We report the temperature dependence of the core electrical parameters and transport characteristics of a flexible version of fin field-effect transistor (FinFET) on silicon-on-insulator (SOI) with sub-20-nm wide fins and high-k/metal gate-stacks. For the first time, we characterize them from room to high temperature (150 °C) to show the impact of temperature variation on drain current, gate leakage current, and transconductance. Variation of extracted parameters, such as low-field mobility, subthreshold swing, threshold voltage, and ON-OFF current characteristics, is reported too. Direct comparison is made to a rigid version of the SOI FinFETs. The mobility degradation with temperature is mainly caused by phonon scattering mechanism. The overall excellent devices performance at high temperature after release is outlined proving the suitability of truly high-performance flexible inorganic electronics with such advanced architecture.
AB - We report the temperature dependence of the core electrical parameters and transport characteristics of a flexible version of fin field-effect transistor (FinFET) on silicon-on-insulator (SOI) with sub-20-nm wide fins and high-k/metal gate-stacks. For the first time, we characterize them from room to high temperature (150 °C) to show the impact of temperature variation on drain current, gate leakage current, and transconductance. Variation of extracted parameters, such as low-field mobility, subthreshold swing, threshold voltage, and ON-OFF current characteristics, is reported too. Direct comparison is made to a rigid version of the SOI FinFETs. The mobility degradation with temperature is mainly caused by phonon scattering mechanism. The overall excellent devices performance at high temperature after release is outlined proving the suitability of truly high-performance flexible inorganic electronics with such advanced architecture.
UR - http://hdl.handle.net/10754/563900
UR - http://ieeexplore.ieee.org/document/6920080/
UR - http://www.scopus.com/inward/record.url?scp=84919497646&partnerID=8YFLogxK
U2 - 10.1109/TED.2014.2360659
DO - 10.1109/TED.2014.2360659
M3 - Article
SN - 0018-9383
VL - 61
SP - 3978
EP - 3984
JO - IEEE Transactions on Electron Devices
JF - IEEE Transactions on Electron Devices
IS - 12
ER -