Silicon wafer wettability and aging behaviors: Impact on gold thin-film morphology

Chemistry

• Wetting 100%
• Aqueous Solution 80%
• Hydrophilicity 60%
• Hydrophobic Surface 60%
• Surface 60%
• Thin Film Morphology 40%
• Mixture 40%
• Water Type 40%
• Vacuum 40%
• Dioxygen 20%
• Nitrogen 20%
• Silicon Dioxide 20%
• Argon 20%
• Adatoms 20%
• Sulfuric Acid 20%
• Liquid Film 20%
• Hydrogen Peroxide 20%
• Hydrophilic Surface 20%
• Nucleation 20%
• Procedure 20%
• Roughness 20%
• Ambient Reaction Temperature 20%
• Group 20%
• Adhesion 20%

Engineering

• Silicon Wafer 100%
• Hydrophobic 60%
• Thin Films 60%
• Hydrophilic 60%
• Surfaces 60%
• Mixture 40%
• Water 40%
• Aging 40%
• Rate Increase 20%
• Room Temperature 20%
• Plasma Treatment 20%
• Hydrophilic Surface 20%
• Oxygen Gas 20%
• Aging Time 20%
• Gas Plasma 20%
• Stages 20%
• Losses 20%
• Roughness 20%
• Impact Behavior 20%