TY - JOUR
T1 - Simplistic graphene transfer process and its impact on contact resistance
AU - Ghoneim, Mohamed T.
AU - Smith, Casey
AU - Hussain, Muhammad Mustafa
N1 - KAUST Repository Item: Exported on 2020-10-01
PY - 2013/5/9
Y1 - 2013/5/9
N2 - Chemical vapor deposition based graphene grown on copper foil is attractive for electronic applications owing to its reliable growth process, large area coverage, and relatively defect free nature. However, transfer of the synthesized graphene to host substrate for subsequent device fabrication is extremely sensitive and can impact ultimate performance. Although ultra-high mobility is graphene's most prominent feature, problems with high contact resistance have severely limited its true potential. Therefore, we report a simple poly-(methyl methacrylate) based transfer process without post-annealing to achieve specific contact resistivity of 3.8 × 10−5 Ω cm2 which shows 80% reduction compared to previously reported values.
AB - Chemical vapor deposition based graphene grown on copper foil is attractive for electronic applications owing to its reliable growth process, large area coverage, and relatively defect free nature. However, transfer of the synthesized graphene to host substrate for subsequent device fabrication is extremely sensitive and can impact ultimate performance. Although ultra-high mobility is graphene's most prominent feature, problems with high contact resistance have severely limited its true potential. Therefore, we report a simple poly-(methyl methacrylate) based transfer process without post-annealing to achieve specific contact resistivity of 3.8 × 10−5 Ω cm2 which shows 80% reduction compared to previously reported values.
UR - http://hdl.handle.net/10754/552306
UR - http://scitation.aip.org/content/aip/journal/apl/102/18/10.1063/1.4804642
UR - http://www.scopus.com/inward/record.url?scp=84877778333&partnerID=8YFLogxK
U2 - 10.1063/1.4804642
DO - 10.1063/1.4804642
M3 - Article
SN - 0003-6951
VL - 102
SP - 183115
JO - Applied Physics Letters
JF - Applied Physics Letters
IS - 18
ER -