TY - GEN
T1 - SIW Cavity Filters with Embedded Planar Resonators in LTCC Package for 5G Applications
AU - Showail, Jameel
AU - Lahti, Markku
AU - Kari, Kautio
AU - Arabi, Eyad
AU - Rantakari, Pekka
AU - Huhtinen, Ismo
AU - Vaha-Heikkila, Tauno
AU - Shamim, Atif
N1 - KAUST Repository Item: Exported on 2020-10-01
Acknowledgements: The authors are grateful for VTT Technical Research Centre of Finland for their consultation on the feasibility of the design. Additionally, they contributed to the work by fabricating the devices and obtaining the measured results. This work was supported by the Finnish Funding Agency for Innovation (Tekes) as part of the 5WAVE project.
PY - 2018/12/7
Y1 - 2018/12/7
N2 - Two three dimensional (3D) integrated System on Package (SoP) Low Temperature Co-fired Ceramic (LTCC) two-stage SIW single cavity filters with embedded planar resonators are designed, fabricated and tested. The embedded resonators create a two-stage effect in a single cavity filter. The design with a stripline ring around the center post of the cavity provides a 13% fractional bandwidth with a center frequency of 28.21 GHz, and with an insertion loss of -0.82 dB. The design that feeds at the middle of a stripline resonator provides a 15% fractional bandwidth at a center frequency of 28.12 GHz, and with an insertion loss of -0.53 dB.
AB - Two three dimensional (3D) integrated System on Package (SoP) Low Temperature Co-fired Ceramic (LTCC) two-stage SIW single cavity filters with embedded planar resonators are designed, fabricated and tested. The embedded resonators create a two-stage effect in a single cavity filter. The design with a stripline ring around the center post of the cavity provides a 13% fractional bandwidth with a center frequency of 28.21 GHz, and with an insertion loss of -0.82 dB. The design that feeds at the middle of a stripline resonator provides a 15% fractional bandwidth at a center frequency of 28.12 GHz, and with an insertion loss of -0.53 dB.
UR - http://hdl.handle.net/10754/631575
UR - https://ieeexplore.ieee.org/document/8541552
UR - http://www.scopus.com/inward/record.url?scp=85059825312&partnerID=8YFLogxK
U2 - 10.23919/EuMC.2018.8541552
DO - 10.23919/EuMC.2018.8541552
M3 - Conference contribution
SN - 9782874870514
SP - 757
EP - 760
BT - 2018 48th European Microwave Conference (EuMC)
PB - Institute of Electrical and Electronics Engineers (IEEE)
ER -