@inproceedings{bac4bae56ec24e71bbad3b52e0f4b794,
title = "STEM imaging applications in deep-sub-micron failure analysis and process characterization",
abstract = "STEM imaging applications in deep-sub-micron failure analysis and process characterization have been discussed.",
author = "K. Li and E. Er and S. Redkar",
note = "Publisher Copyright: {\textcopyright} 2003 IEEE.; 10th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2003 ; Conference date: 11-07-2003",
year = "2003",
doi = "10.1109/IPFA.2003.1222767",
language = "English (US)",
series = "Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "206--209",
editor = "Philip Ho and Daniel Chan and Alastair Trigg and John Thong",
booktitle = "Proceedings of the 10th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2003",
address = "United States",
}