TY - JOUR
T1 - Stick-slip substructure in rapid tape peeling
AU - Thoroddsen, Sigurdur T
AU - Nguyen, H. D.
AU - Takehara, K.
AU - Etoh, T. G.
N1 - KAUST Repository Item: Exported on 2020-10-01
PY - 2010/10/15
Y1 - 2010/10/15
N2 - The peeling of adhesive tape is known to proceed with a stick-slip mechanism and produces a characteristic ripping sound. The peeling also produces light and when peeled in a vacuum, even X-rays have been observed, whose emissions are correlated with the slip events. Here we present direct imaging of the detachment zone when Scotch tape is peeled off at high speed from a solid surface, revealing a highly regular substructure, during the slip phase. The typical 4-mm-long slip region has a regular substructure of transverse 220 μm wide slip bands, which fracture sideways at speeds over 300 m/s. The fracture tip emits waves into the detached section of the tape at ∼100 m/s, which promotes the sound, so characteristic of this phenomenon.
AB - The peeling of adhesive tape is known to proceed with a stick-slip mechanism and produces a characteristic ripping sound. The peeling also produces light and when peeled in a vacuum, even X-rays have been observed, whose emissions are correlated with the slip events. Here we present direct imaging of the detachment zone when Scotch tape is peeled off at high speed from a solid surface, revealing a highly regular substructure, during the slip phase. The typical 4-mm-long slip region has a regular substructure of transverse 220 μm wide slip bands, which fracture sideways at speeds over 300 m/s. The fracture tip emits waves into the detached section of the tape at ∼100 m/s, which promotes the sound, so characteristic of this phenomenon.
UR - http://hdl.handle.net/10754/554107
UR - http://link.aps.org/doi/10.1103/PhysRevE.82.046107
UR - http://www.scopus.com/inward/record.url?scp=78651264212&partnerID=8YFLogxK
U2 - 10.1103/PhysRevE.82.046107
DO - 10.1103/PhysRevE.82.046107
M3 - Article
C2 - 21230345
SN - 1539-3755
VL - 82
JO - Physical Review E
JF - Physical Review E
IS - 4
ER -