Stress management and reliability assessment in electronic packaging

S. Vaynman; H. Mavoori; J. Chin; M. E. Fine; B. Moran; L. M. Keer

Stress management and reliability assessment in electronic packaging

S. Vaynman^*, H. Mavoori, J. Chin, M. E. Fine, B. Moran, L. M. Keer

^*Corresponding author for this work

Research output: Contribution to journal › Conference article › peer-review

1 Scopus citations

Abstract

Thermomechanical problems are one of an electronic package designer's concerns. Since microelectronic packaging involves a wide variety of materials and structures subjected to diverse processing and operating conditions, complex thermal stress failure mechanisms are encountered. In electronic assemblies, stresses arise primarily from differences on coefficients in thermal expansion of the components of the assembly. This presentation gives an overview of the issues involved in stress management and assesses the effects of these stresses in the reliability of the component.

Original language	English (US)
Pages (from-to)	1711-1726
Number of pages	16
Journal	National Electronic Packaging and Production Conference-Proceedings of the Technical Program (West and East)
Volume	3
State	Published - 1996
Externally published	Yes
Event	Proceedings of the NEPCON WEST'96. Part 1 (of 3) - Anaheim, CA, USA Duration: Feb 25 1996 → Feb 29 1996

ASJC Scopus subject areas

Electrical and Electronic Engineering

Cite this

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title = "Stress management and reliability assessment in electronic packaging",

abstract = "Thermomechanical problems are one of an electronic package designer's concerns. Since microelectronic packaging involves a wide variety of materials and structures subjected to diverse processing and operating conditions, complex thermal stress failure mechanisms are encountered. In electronic assemblies, stresses arise primarily from differences on coefficients in thermal expansion of the components of the assembly. This presentation gives an overview of the issues involved in stress management and assesses the effects of these stresses in the reliability of the component.",

author = "S. Vaynman and H. Mavoori and J. Chin and Fine, {M. E.} and B. Moran and Keer, {L. M.}",

year = "1996",

language = "English (US)",

volume = "3",

pages = "1711--1726",

journal = "National Electronic Packaging and Production Conference-Proceedings of the Technical Program (West and East)",

issn = "0470-0155",

note = "Proceedings of the NEPCON WEST'96. Part 1 (of 3) ; Conference date: 25-02-1996 Through 29-02-1996",

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TY - JOUR

T1 - Stress management and reliability assessment in electronic packaging

AU - Vaynman, S.

AU - Mavoori, H.

AU - Chin, J.

AU - Fine, M. E.

AU - Moran, B.

AU - Keer, L. M.

PY - 1996

Y1 - 1996

N2 - Thermomechanical problems are one of an electronic package designer's concerns. Since microelectronic packaging involves a wide variety of materials and structures subjected to diverse processing and operating conditions, complex thermal stress failure mechanisms are encountered. In electronic assemblies, stresses arise primarily from differences on coefficients in thermal expansion of the components of the assembly. This presentation gives an overview of the issues involved in stress management and assesses the effects of these stresses in the reliability of the component.

AB - Thermomechanical problems are one of an electronic package designer's concerns. Since microelectronic packaging involves a wide variety of materials and structures subjected to diverse processing and operating conditions, complex thermal stress failure mechanisms are encountered. In electronic assemblies, stresses arise primarily from differences on coefficients in thermal expansion of the components of the assembly. This presentation gives an overview of the issues involved in stress management and assesses the effects of these stresses in the reliability of the component.

UR - http://www.scopus.com/inward/record.url?scp=0029718132&partnerID=8YFLogxK

M3 - Conference article

AN - SCOPUS:0029718132

SN - 0470-0155

VL - 3

SP - 1711

EP - 1726

JO - National Electronic Packaging and Production Conference-Proceedings of the Technical Program (West and East)

JF - National Electronic Packaging and Production Conference-Proceedings of the Technical Program (West and East)

T2 - Proceedings of the NEPCON WEST'96. Part 1 (of 3)

Y2 - 25 February 1996 through 29 February 1996

ER -

Stress management and reliability assessment in electronic packaging

Abstract

ASJC Scopus subject areas

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