Sub-100-nm current-perpendicular-to-plane sensor fabrication

Y. K. Zheng; K. B. Li; J. J. Qiu; G. C. Han; Z. B. Guo; B. Y. Zong; L. H. An; P. Luo; Z. Y. Liu; Y. H. Wu

doi:10.1109/TMAG.2004.830204

Sub-100-nm current-perpendicular-to-plane sensor fabrication

Y. K. Zheng^*, K. B. Li, J. J. Qiu, G. C. Han, Z. B. Guo, B. Y. Zong, L. H. An, P. Luo, Z. Y. Liu, Y. H. Wu

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

6 Scopus citations

Abstract

Two sets of processes for sub-100-nm current-perpendicular-to-plane (CPP) spin-valves (SVs) were developed. In the first method, a CPP SV was fabricated by using via-hole instead of small cell patterning. This method makes it easy to characterize the CPP spin valve films. The shunting effect has been analyzed in this method. In the second method, a resist layer for planarization, ionmilling, and wet etching for self-opening vla-hole in a self-aligned fashion by making use of the height difference between the cell and surrounding regions was introduced. This method is suitable for the actual recording heads with small dimension even without an ion-beam-deposition system. CPP sensors with size from 0.05 μm 0.05 μm to 0.4 μm · 0.5μm with different free-layer structures have been investigated by means of the first method.

Original language	English (US)
Pages (from-to)	2248-2250
Number of pages	3
Journal	IEEE Transactions on Magnetics
Volume	40
Issue number	4 II
DOIs	https://doi.org/10.1109/TMAG.2004.830204
State	Published - Jul 2004
Externally published	Yes

Keywords

Current-perpendicular-to-plane (CPP)
Giant magnetoresistance (GMR) effect
Probe recording
Spin-valve (SV)

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

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10.1109/TMAG.2004.830204

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@article{3b790bb3b05446ec8e5a75d2e37ee005,

title = "Sub-100-nm current-perpendicular-to-plane sensor fabrication",

abstract = "Two sets of processes for sub-100-nm current-perpendicular-to-plane (CPP) spin-valves (SVs) were developed. In the first method, a CPP SV was fabricated by using via-hole instead of small cell patterning. This method makes it easy to characterize the CPP spin valve films. The shunting effect has been analyzed in this method. In the second method, a resist layer for planarization, ionmilling, and wet etching for self-opening vla-hole in a self-aligned fashion by making use of the height difference between the cell and surrounding regions was introduced. This method is suitable for the actual recording heads with small dimension even without an ion-beam-deposition system. CPP sensors with size from 0.05 μm 0.05 μm to 0.4 μm · 0.5μm with different free-layer structures have been investigated by means of the first method.",

keywords = "Current-perpendicular-to-plane (CPP), Giant magnetoresistance (GMR) effect, Probe recording, Spin-valve (SV)",

author = "Zheng, {Y. K.} and Li, {K. B.} and Qiu, {J. J.} and Han, {G. C.} and Guo, {Z. B.} and Zong, {B. Y.} and An, {L. H.} and P. Luo and Liu, {Z. Y.} and Wu, {Y. H.}",

year = "2004",

month = jul,

doi = "10.1109/TMAG.2004.830204",

language = "English (US)",

volume = "40",

pages = "2248--2250",

journal = "IEEE Transactions on Magnetics",

issn = "0018-9464",

publisher = "Institute of Electrical and Electronics Engineers",

number = "4 II",

}

TY - JOUR

T1 - Sub-100-nm current-perpendicular-to-plane sensor fabrication

AU - Zheng, Y. K.

AU - Li, K. B.

AU - Qiu, J. J.

AU - Han, G. C.

AU - Guo, Z. B.

AU - Zong, B. Y.

AU - An, L. H.

AU - Luo, P.

AU - Liu, Z. Y.

AU - Wu, Y. H.

PY - 2004/7

Y1 - 2004/7

N2 - Two sets of processes for sub-100-nm current-perpendicular-to-plane (CPP) spin-valves (SVs) were developed. In the first method, a CPP SV was fabricated by using via-hole instead of small cell patterning. This method makes it easy to characterize the CPP spin valve films. The shunting effect has been analyzed in this method. In the second method, a resist layer for planarization, ionmilling, and wet etching for self-opening vla-hole in a self-aligned fashion by making use of the height difference between the cell and surrounding regions was introduced. This method is suitable for the actual recording heads with small dimension even without an ion-beam-deposition system. CPP sensors with size from 0.05 μm 0.05 μm to 0.4 μm · 0.5μm with different free-layer structures have been investigated by means of the first method.

AB - Two sets of processes for sub-100-nm current-perpendicular-to-plane (CPP) spin-valves (SVs) were developed. In the first method, a CPP SV was fabricated by using via-hole instead of small cell patterning. This method makes it easy to characterize the CPP spin valve films. The shunting effect has been analyzed in this method. In the second method, a resist layer for planarization, ionmilling, and wet etching for self-opening vla-hole in a self-aligned fashion by making use of the height difference between the cell and surrounding regions was introduced. This method is suitable for the actual recording heads with small dimension even without an ion-beam-deposition system. CPP sensors with size from 0.05 μm 0.05 μm to 0.4 μm · 0.5μm with different free-layer structures have been investigated by means of the first method.

KW - Current-perpendicular-to-plane (CPP)

KW - Giant magnetoresistance (GMR) effect

KW - Probe recording

KW - Spin-valve (SV)

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U2 - 10.1109/TMAG.2004.830204

DO - 10.1109/TMAG.2004.830204

M3 - Article

AN - SCOPUS:4444361775

SN - 0018-9464

VL - 40

SP - 2248

EP - 2250

JO - IEEE Transactions on Magnetics

JF - IEEE Transactions on Magnetics

IS - 4 II

ER -

Sub-100-nm current-perpendicular-to-plane sensor fabrication

Abstract

Keywords

ASJC Scopus subject areas

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