TY - JOUR
T1 - Surface Photon-Engineered Infrared-Black Metametal Enabled Enhancement of Heat Dissipation
AU - Tian, Yanpei
AU - Liu, Xiaojie
AU - Xie, Lijia
AU - Xu, Shilin
AU - Chen, Fangqi
AU - Mu, Ying
AU - Liu, Yang
AU - Minus, Marilyn L.
AU - Zheng, Yi
N1 - Generated from Scopus record by KAUST IRTS on 2023-09-23
PY - 2022/11/10
Y1 - 2022/11/10
N2 - Heat dissipation is a severe barrier for ever-smaller and more functionalized electronics, necessitating the continuous development of accessible, cost-effective, and highly efficient cooling solutions. Metals, such as silver and copper, with high thermal conductivity, can efficiently remove heat. However, ultralow infrared thermal emittance (
AB - Heat dissipation is a severe barrier for ever-smaller and more functionalized electronics, necessitating the continuous development of accessible, cost-effective, and highly efficient cooling solutions. Metals, such as silver and copper, with high thermal conductivity, can efficiently remove heat. However, ultralow infrared thermal emittance (
UR - https://onlinelibrary.wiley.com/doi/10.1002/adfm.202205016
UR - http://www.scopus.com/inward/record.url?scp=85137331162&partnerID=8YFLogxK
U2 - 10.1002/adfm.202205016
DO - 10.1002/adfm.202205016
M3 - Article
SN - 1057-9257
VL - 32
JO - Advanced Functional Materials
JF - Advanced Functional Materials
IS - 46
ER -