Surface Photon-Engineered Infrared-Black Metametal Enabled Enhancement of Heat Dissipation

Yanpei Tian, Xiaojie Liu, Lijia Xie, Shilin Xu, Fangqi Chen, Ying Mu, Yang Liu, Marilyn L. Minus, Yi Zheng

Research output: Contribution to journalArticlepeer-review

3 Scopus citations

Abstract

Heat dissipation is a severe barrier for ever-smaller and more functionalized electronics, necessitating the continuous development of accessible, cost-effective, and highly efficient cooling solutions. Metals, such as silver and copper, with high thermal conductivity, can efficiently remove heat. However, ultralow infrared thermal emittance (
Original languageEnglish (US)
JournalAdvanced Functional Materials
Volume32
Issue number46
DOIs
StatePublished - Nov 10 2022
Externally publishedYes

ASJC Scopus subject areas

  • General Chemical Engineering
  • Electronic, Optical and Magnetic Materials

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