Topography study on 45nm CuCMP low-k process and its impact on defectivity and resistance

Feng Zhao*, Benfu Lin, Hong Yu, San Leong Lup, Bin Wang Xian, Mei Sheng Zhou, Haigou Huang, Hong Wu, Fan Zhang, Jun Chen, Chao Zhang Bei

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Fingerprint

Dive into the research topics of 'Topography study on 45nm CuCMP low-k process and its impact on defectivity and resistance'. Together they form a unique fingerprint.

Keyphrases