Topography study on 45nm CuCMP low-k process and its impact on defectivity and resistance

Feng Zhao*, Benfu Lin, Hong Yu, San Leong Lup, Bin Wang Xian, Mei Sheng Zhou, Haigou Huang, Hong Wu, Fan Zhang, Jun Chen, Chao Zhang Bei

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

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Material Science