Abstract
This article presents the transient analysis of an advanced adsorption cooling device utilizing copper sputtered silica-gel as adsorbent and water as adsorbate, which is based on the experimentally confirmed adsorption isotherms and kinetics data so that an innovative and interesting solid sorption cooler can be developed for micro-electronics cooling purposes. In this paper, we also furnish the adsorption isotherms and kinetics data of copper sputtered silica-gel and water systems. A detailed transient computer simulation has been conducted to calculate its performances in terms of cooling capacity for various heat source temperatures and a constant heat sink temperature of 30 °C. It is found that the proposed innovative cooling cycle yields a cooling capacity up to 20 Watt per cm2, and is operated effectively by low-grade waste heat sources of temperature as low as 60 °C. Another noteworthy finding is that, the load surface temperature is able to achieve 20 °C for the cooling capacity of 10 Watt/cm2.
| Original language | English (US) |
|---|---|
| Title of host publication | 4th Asian Conference on Refrigeration and Air-Conditioning, ACRA 2009 |
| Publisher | National Taipei University of Technology |
| Pages | 293-298 |
| Number of pages | 6 |
| ISBN (Print) | 9868509610, 9789868509610 |
| State | Published - 2009 |
| Externally published | Yes |
| Event | 4th Asian Conference on Refrigeration and Air-Conditioning, ACRA 2009 - Taipei, Taiwan, Province of China Duration: May 20 2009 → May 22 2009 |
Other
| Other | 4th Asian Conference on Refrigeration and Air-Conditioning, ACRA 2009 |
|---|---|
| Country/Territory | Taiwan, Province of China |
| City | Taipei |
| Period | 05/20/09 → 05/22/09 |
Keywords
- Adsorption
- Cu-sputtered silica-gel
- Isotherms
- Load surface
- Micro cooling
- Transient analysis
ASJC Scopus subject areas
- Chemical Engineering (miscellaneous)