TY - GEN
T1 - Ultra-Thin CMOS-Compatible Artificial Magnetic Conductor for Millimeter-Wave Antenna-on-Chip
AU - Yu, Yiyang
AU - Shamim, Atif
N1 - Publisher Copyright:
© 2024 IEEE.
PY - 2024
Y1 - 2024
N2 - Antenna-on-chip (AoC) is one of the promising solutions in the 6G era. However, it suffers from poor radiation due to the lossy Si substrate. Placing an artificial magnetic conductor (AMC) under the AoC cannot only isolate the AoC from the lossy Si substrate but also provide in-phase reflection. Nonetheless, the ultra-thin stack-up of the mainstream semiconductor technology makes the realization of AMC challenging at the millimeter-wave spectrum. To make the AMC electrically thicker, this paper presents four kinds of thickness reduction techniques (TRT): slot, notch, metallic post, and embedded guiding structure. With TRTs, an ultra-thin AMC (15 μ m thickness) is realized. With the proposed AMC, the AoC demonstrated a gain of 3.2 dB at 72 GHz. Compared to the standalone antenna, the AMC enhances the gain by 7 dB.
AB - Antenna-on-chip (AoC) is one of the promising solutions in the 6G era. However, it suffers from poor radiation due to the lossy Si substrate. Placing an artificial magnetic conductor (AMC) under the AoC cannot only isolate the AoC from the lossy Si substrate but also provide in-phase reflection. Nonetheless, the ultra-thin stack-up of the mainstream semiconductor technology makes the realization of AMC challenging at the millimeter-wave spectrum. To make the AMC electrically thicker, this paper presents four kinds of thickness reduction techniques (TRT): slot, notch, metallic post, and embedded guiding structure. With TRTs, an ultra-thin AMC (15 μ m thickness) is realized. With the proposed AMC, the AoC demonstrated a gain of 3.2 dB at 72 GHz. Compared to the standalone antenna, the AMC enhances the gain by 7 dB.
UR - http://www.scopus.com/inward/record.url?scp=85207095073&partnerID=8YFLogxK
U2 - 10.1109/AP-S/INC-USNC-URSI52054.2024.10686322
DO - 10.1109/AP-S/INC-USNC-URSI52054.2024.10686322
M3 - Conference contribution
AN - SCOPUS:85207095073
T3 - IEEE Antennas and Propagation Society, AP-S International Symposium (Digest)
SP - 2167
EP - 2168
BT - 2024 IEEE International Symposium on Antennas and Propagation and INC/USNCURSI Radio Science Meeting, AP-S/INC-USNC-URSI 2024 - Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2024 IEEE International Symposium on Antennas and Propagation and INC/USNCURSI Radio Science Meeting, AP-S/INC-USNC-URSI 2024
Y2 - 14 July 2024 through 19 July 2024
ER -