TY - JOUR
T1 - Wax-bonding 3D microfluidic chips
AU - Gong, Xiuqing
AU - Yi, Xin
AU - Xiao, Kang
AU - Li, Shunbo
AU - Kodzius, Rimantas
AU - Qin, Jianhua
AU - Wen, Weijia
N1 - KAUST Repository Item: Exported on 2020-10-01
Acknowledged KAUST grant number(s): SA-C0040/UK-C0016
Acknowledgements: Award No. SA-C0040/UK-C0016, made by King Abdullah University of Science and Technology (KAUST); Hong Kong RGC grants HKUST 603608; Nanoscience and Nanotechnology Program at HKUST
PY - 2010/8/5
Y1 - 2010/8/5
N2 - We report a simple, low-cost and detachable microfluidic chip incorporating easily accessible paper, glass slides or other polymer films as the chip materials along with adhesive wax as the recycling bonding material. We use a laser to cut through the paper or film to form patterns and then sandwich the paper and film between glass sheets or polymer membranes . The hot-melt adhesive wax can realize bridge bonding between various materials, for example, paper, polymethylmethacrylate (PMMA) film, glass sheets, or metal plate. The bonding process is reversible and the wax is reusable through a melting and cooling process. With this process, a three-dimensional (3D) microfluidic chip is achievable by vacuating and venting the chip in a hot-water bath. To study the biocompatibility and applicability of the wax-based microfluidic chip, we tested the PCR compatibility with the chip materials first. Then we applied the wax-paper based microfluidic chip to HeLa cell electroporation (EP ). Subsequently, a prototype of a 5-layer 3D chip was fabricated by multilayer wax bonding. To check the sealing ability and the durability of the chip, green fluorescence protein (GFP) recombinant Escherichia coli (E. coli) bacteria were cultured, with which the chemotaxis of E. coli was studied in order to determine the influence of antibiotic ciprofloxacin concentration on the E. coli migration.
AB - We report a simple, low-cost and detachable microfluidic chip incorporating easily accessible paper, glass slides or other polymer films as the chip materials along with adhesive wax as the recycling bonding material. We use a laser to cut through the paper or film to form patterns and then sandwich the paper and film between glass sheets or polymer membranes . The hot-melt adhesive wax can realize bridge bonding between various materials, for example, paper, polymethylmethacrylate (PMMA) film, glass sheets, or metal plate. The bonding process is reversible and the wax is reusable through a melting and cooling process. With this process, a three-dimensional (3D) microfluidic chip is achievable by vacuating and venting the chip in a hot-water bath. To study the biocompatibility and applicability of the wax-based microfluidic chip, we tested the PCR compatibility with the chip materials first. Then we applied the wax-paper based microfluidic chip to HeLa cell electroporation (EP ). Subsequently, a prototype of a 5-layer 3D chip was fabricated by multilayer wax bonding. To check the sealing ability and the durability of the chip, green fluorescence protein (GFP) recombinant Escherichia coli (E. coli) bacteria were cultured, with which the chemotaxis of E. coli was studied in order to determine the influence of antibiotic ciprofloxacin concentration on the E. coli migration.
UR - http://hdl.handle.net/10754/303150
UR - http://xlink.rsc.org/?DOI=c004744a
UR - http://www.scopus.com/inward/record.url?scp=77956306767&partnerID=8YFLogxK
U2 - 10.1039/c004744a
DO - 10.1039/c004744a
M3 - Article
SN - 1473-0197
VL - 10
SP - 2622
JO - Lab on a Chip
JF - Lab on a Chip
IS - 19
ER -